Mem-Mar 22, 2007
From STDFGroup
STDF Memory Datalog meeting Notes
Date*: 22nd Mar 2007
Attendees:
Kochen Liao Qualcomm
Liang Lai Mentor Graphics
Sauro Landini ARM
Ajay Khoche Verigy
John Rowe Teradyne
Agenda:
- Review of requirement document from Yield Dynamics
Minutes:
Review of Requirement Document:
- Raw bitmap data from ATE could be in ASCII or Binary format.
- Currently support Kensington, Advantest and other proprietary formats using custom parsers
- Data is typically compressed
- One file/die/test program is created
- Fail addresses can be logical or topological
- Other information includes Lot id, Wafer ID, Die coordinates, Test Program ID. Pl. Check the presentation on the web for details.
- Cycle based failure information needs to converted to X,Y bit fails before it could be processed by the tool
- Curently supports SDRAM, Flash, DRAM
- layout file is used to relate patterns to the physical location that is being tested.
- Descrambling information is provided by the customer to the tool
- The tool also correlates the fails with inline measurement data that comes in the KLARF format.
- The parametric data is typcially provided to the tool in the STDF format.
Action Items:
- Get PDF solution to present the requirements to the group (Ajay)
- Get Virage Logic to present the requirements to the group (Ajay)
- Prepare starting requirements document (Ajay)
- Review ST' proposal (All)
