Jan 25, 2007

From STDFGroup

STDF Scan datalog meeting Notes

Date: 25 Jan 2007

Attendees:

Glenn Plowman - Qualcomm

Ajay Khoche - Verigy

Phil Burlinson - Inovys

Davide Appello - ST

Cy Hay - Synopsys

Gary Green - Synopsys

Rohit Kapur - Synopsys

Zhijian - Synopsys

Ping Wen - Yield Dynamics

Andreas Leininger – Infineon

John Rowe - Teradyne

Agenda:

1. Requirements & Drafts discussions
2. Next meeting

Minutes:

Requirements and Draft discussions

• Reviewed the RosettaNet document for Part Identification. Following observations/decisions were made.
  • The identification mechanism show have a mandatory set of fields that meet majority of requirements and the tool can consistently rely on them.
  • The identification mechanism should allow a set of optional fields for any environment specific extensions
  • For Die on Wafer identification following fields should be supported are commonly use in tools/environments of the member companies and should be part of mandatory sections
    • Wafer ID
    • Lot ID
    • X, Y Coordinates
    • Electronic IDs
  • The mechanism should allow for identification of dice on a multi\-project wafers.
  • For Package identification following fields must be supported
    • Serial number
    • Electronic ID
    • Die with in a package for SiPs
  • In addition following requirement can be added in the optional fields
    • Probe card ID
    • Site description

Next Meeting:

• In view of Christmas and New year's holidays, the next meeting is schedule to be on Feb 8^th^ at 8.00AM PST.
  • Same conf call number
  • Ajay to send invitation for the web conferencing before the meeting

New Action Items:

• Create a data model for the Part Identification – Gelnn & Ajay
• Present the use cases and terminology – Glenn, Davide, Phil & Cy
• Update presentation with update from this meeting – Ajay
• Remove Verigy logos from the presentation – Ajay